MAX8836ZEREEE+T【PDF 12/19 页】IC REG DL BCK/LINEAR SYNC 16UCSP

1.2A PWM Step-Down Converter in

2mm x 2mm WLP/UCSP for PA Power

12 ______________________________________________________________________________________

The MAX8836Z maximum power dissipation depends

on the thermal resistance of the IC package and circuit

board, the temperature difference between the die

junction and ambient air, and the rate of airflow. The

power dissipated in the device is:

P

DISS

= P

PA

x (1/?/DIV>

PA

- 1) + I

LDO2

x (V

IN2

- V

LDO2

)

where ?/DIV>

PA

is the efficiency of the PA step-down con-

verter and P

PA

is the output power of the PA step-down

converter.

The maximum allowed power dissipation is:

P

MAX

= (T

JMAX

- T

A

)/?/DIV>

JA

where (T

JMAX

- T

A

) is the temperature difference

between the MAX8836Z die junction and the surround-

ing air; ?/DIV>

JA

is the thermal resistance of the junction

through the PCB, copper traces, and other materials to

the surrounding air.

PCB Layout

High switching frequencies and relatively large peak cur-

rents make the PCB layout a very important part of

design. Good design minimizes excessive EMI on the

feedback paths and voltage gradients in the ground

plane, resulting in a stable and well-regulated output.

Connect C

IN1

close to IN1A/IN1B and PGND. Connect

the inductor and output capacitor as close as possible to

the IC and keep their traces short, direct, and wide. Keep

noisy traces, such as the LX node, as short as possible.

Figure 3 illustrates an example PCB layout and routing

scheme. Note that Figure 3 does not show the common

ground plane connection of AGND and PGND. Refer to

the MAX8805W Evaluation Kit for more information.

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